Pitfalls of Relying solely on Bulk Electrical Properties – depth profiling provides deeper insight into semiconductor films
July 31, 2019Invited paper: Differential Hall Effect Metrology (DHEM) Sub-Nm Profiling and Its Application to Dopant Activation in n-Type Ge (237th ECS, May 2020)
March 15, 2020Scotts Valley, CA October 16, 2019 – ALP has been awarded a SBIR Phase I grant by National Science Foundation (NSF) to develop a novel technology, which will provide electrical property depth profiles through three dimensional (3D) semiconductor structures (https://www.nsf.
This new work will focus on development of technology to profile 3D materials, like FIN devices, and provide a crucial link between process changes and the electrical property of the 3D material.
